Prime&Bond – One Etch&Rinse

Prime&Bond one etch & rinse

Prime&Bond One Etch & Rinse is a fifth-generation, one-component dental adhesive ideal for total etch techniques. It offers consistent performance regardless of dentine moisture, strong adhesion to dentine, ceramics, and metals, and prevents post-operative sensitivity and leakage. The system uses tetra-butane as a solvent and includes a Self Cure Activator for indirect restorations, ensuring versatility and reliability in various dental procedures.

Features of Prime&Bond one etch & rinse

• Different levels of dentine moisture do not affect the performance of the adhesive.
• The versatility of a one-component system for total etching techniques.
• Use of Self Cure Activator in the dark phase for indirect restorations.
• Does not lead to post-operative sensitivity at the application site and does not allow leakage.